Failure Analysis, RF, Microwave, RMA, Quality, IC

Apply by eMail:15353731.185@jobfrenzy1.com

Description:
Failure Analysis, RF, Microwave, RMA, Quality, IC Failure Analysis, RF, Microwave, RMA, Quality, IC, FET/MMIC, Wire Bonding, Soldering/substrate/Die A - Skills Required - Failure Analysis, RF, Microwave, RMA, Quality, IC, FET/MMIC, Wire Bonding, Soldering/substrate/Die Attach Senior Failure Analysis EngineerSan Diego, CADirect Hire/PermSecurity Clearance Required (have or be able to Obtain)We are looking for a quality-focused Failure Analysis professional to join our team. In this role you will tasked with the following responsibilities: Evaluate the electrical and mechanical characteristics of systems and/or integrated circuits, components, sub-components and systems to determine the root cause of failure, including the verification of analog and digital performance. Analyze failures reports and recommends corrective action; develop methods, processes, procedures and equipment that will improve the failure analysis process and/or reduce failures. Improve customer relations and internal product quality of RF components and sub-systems through corrective action closure. Interface with customers and management; represent Quality Assurance in Material Review Board approval/disapproval of defective product. The ideal candidate for this position will be someone that is both customer and quality focused, who can bring the following qualifications to the table: Ten (10) years of related experience in testing or failure analysis of microwave assemblies, including proficiency in failure analysis processes, Returned Material Authorization (RMA) and manufacturing product flow from assembly through final inspection Bachelor of Science degree in Electrical Engineering, Industrial Engineering or related field, required. An ability to successfully analyze and evaluate quality or performance; understanding of RF and DC circuitry. Knowledge of micro-electronic assembly techniques including soldering, substrate and die attach using solder, epoxy and eutectic media. Knowledge of wire bonding process, required. Knowledge of electrical circuits, including micro-electronic resistors, capacitors, diodes, transistors integrated circuits, FET's and MMIC devices. Familiarity with X-ray and video photography systems such as MIDEO and X-Ray Working knowledge of MS Office, including Outlook, Word, Excel and Power Point. An ability to read blue prints; exposure to Enterprise-wide system, such as SAP, a plus; Required to obtain and maintain security clearance, which requires USA Citizenship. - RH-FailureAnalysisEngSD - , , , , , CyberCoders CyberScientific

Requirements:
See Above

Education: Not Specified

Experience: Not Specified

Travel: Not Specified

Apply by eMail:15353731.185@jobfrenzy1.com

Job Created: Sat Oct 31 2009 04:29:00 AM
Last Modified: Sat Oct 31 2009 04:29:00 AM